View TDA8777HL14C1-T_547519.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
Rev. 04 -- 11 April 2006 Product data sheet
1. General description
The TDA8777 consists of three separate 10-bit video Digital-to-Analog Converters (DACs) with complementary outputs. They convert the digital input signals into analog current outputs at a maximum conversion rate of 330 MHz. The DACs are based on current source architecture. A sync pulse can be added to the green signal (sync-on-green) to allow devices driven by the video DAC to be synchronized. The TDA8777 has a Power-down mode to reduce power consumption during inactive periods. The TDA8777 is fabricated in a CMOS process that ensures high functionality with low power dissipation.
2. Features
I I I I I I I I I I I Triple 10-bit DAC Sampling frequency up to 330 MHz Internal voltage reference (1.21 V) Complementary outputs Direct drive of double terminated 75 load into standard level TTL compatible input Sync and blank control inputs Analog output current source Power-down mode 3.3 V power supply LQFP48 package
3. Applications
I I I I PC video cards High resolution image processing Digital video systems General purpose high-speed digital-to-analog conversion
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
4. Quick reference data
Table 1. Symbol VDDA IDDA INL DNL fCLK Quick reference data Parameter analog supply voltage analog supply current integral non-linearity differential non-linearity clock frequency TDA8777HL/14/C1 TDA8777HL/24/C1 TDA8777HL/33/C1 Ptot Ipd total power dissipation current in Power-down mode 297 20 140 240 330 MHz MHz MHz mW mA Conditions Min 3.0 -2 -1 Typ 3.3 90 Max 3.6 +2 +1 Unit V mA LSB LSB
5. Ordering information
Table 2. Ordering information Package Name TDA8777HL/14/C1 TDA8777HL/24/C1 TDA8777HL/33/C1 LQFP48 Description plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm Version Sampling frequency Type number
SOT313-2 140 MHz 240 MHz 330 MHz
TDA8777_4
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 -- 11 April 2006
2 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
6. Block diagram
VSSA2 VSSA1 PSAVE RSET COMP
VDDA3 VDDA2 VDDA1 48-39
30 29 13 POR
26
25
38
37
35
36
TDA8777
10
CURRENT/VOLTAGE REFERENCE Vref + Iref Iref 34 10-BIT DAC Vref + Iref 33
VREF
red digital inputs (bits R9 to R0)
10
10
OUTR OUTR
green digital inputs (bits G9 to G0)
10-1
10
TRIPLE MULTIPLEXER
10
BLANKING 10 INSERT
32 10-BIT DAC SYNC INSERT 31
OUTG OUTG
Vref + Iref 23-14 blue digital inputs (bits B9 to B0) 10 10 10 10-BIT DAC sync DAC CONTROL MODULE 24 CLK 11 BLANK 12 SYNC 28 27 OUTB OUTB
mle290
Fig 1. Block diagram
TDA8777_4
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 -- 11 April 2006
3 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
7. Pinning information
7.1 Pinning
38 PSAVE
G0 G1 G2 G3 G4 G5 G6 G7 G8
1 2 3 4 5 6 7 8 9
37 RSET 36 VREF 35 COMP 34 OUTR 33 OUTR 32 OUTG 31 OUTG 30 VDDA3 29 VDDA2 28 OUTB 27 OUTB 26 VSSA2 25 VSSA1 CLK 24
001aad432
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
48 R9
47 R8
46 R7
45 R6
44 R5
43 R4
42 R3
41 R2 B6 20
40 R1 B7 21
TDA8777HL
G9 10 BLANK 11 SYNC 12 VDDA1 13 B0 14 B1 15 B2 16 B3 17 B4 18 B5 19 B8 22 B9 23
Fig 2. Pin configuration
7.2 Pin description
Table 3. Symbol G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 BLANK SYNC VDDA1 B0 B1 B2
TDA8777_4
Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Description green digital input data; bit 0 (LSB) green digital input data; bit 1 green digital input data; bit 2 green digital input data; bit 3 green digital input data; bit 4 green digital input data; bit 5 green digital input data; bit 6 green digital input data; bit 7 green digital input data; bit 8 green digital input data; bit 9 (MSB) composite blank control input (active LOW) composite sync control input; for green channel only (active LOW) analog supply voltage 1 blue digital input data; bit 0 (LSB) blue digital input data; bit 1 blue digital input data; bit 2
Product data sheet
Rev. 04 -- 11 April 2006
39 R0
4 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
Pin description ...continued Pin 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 Description blue digital input data; bit 3 blue digital input data; bit 4 blue digital input data; bit 5 blue digital input data; bit 6 blue digital input data; bit 7 blue digital input data; bit 8 blue digital input data; bit 9 (MSB) clock input analog supply ground 1 analog supply ground 2 complementary blue current analog output blue current analog output analog supply voltage 2 analog supply voltage 3 complementary green current analog output green current analog output complementary red current analog output red current analog output compliance voltage output voltage reference input full-scale current control resistor pin power-save control input (active LOW) red digital input data; bit 0 (LSB) red digital input data; bit 1 red digital input data; bit 2 red digital input data; bit 3 red digital input data; bit 4 red digital input data; bit 5 red digital input data; bit 6 red digital input data; bit 7 red digital input data; bit 8 red digital input data; bit 9 (MSB)
Table 3. Symbol B3 B4 B5 B6 B7 B8 B9 CLK VSSA1 VSSA2 OUTB OUTB VDDA2 VDDA3 OUTG OUTG OUTR OUTR COMP VREF RSET PSAVE R0 R1 R2 R3 R4 R5 R6 R7 R8 R9
8. Functional description
This triple 10-bit video DAC is designed to convert digital input signals into analog output currents. All inputs (clock, data, blank and sync) must be TLL levels.
8.1 Voltage reference
The voltage reference input to pin VREF should be 1.21 V. For correct operation, a 100 nF capacitor should be connected between pin VREF and pin VDDA.
TDA8777_4 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 -- 11 April 2006
5 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
An external reference resistor must be connected between pin RSET and analog ground. This resistor sets the reference current which determines the analog output level, and is specified to be 560 . This value allows a 1 V (p-p) output (video plus sync) into a 37.5 load, such as a double-terminated 75 coaxial cable.
8.2 Blanking and sync pulse insertion
The video signal (see Figure 3) is comprised of the following three parts:
* The video information: defined by the 10 bits used to drive the DAC; nominal signal
amplitude = 700 mV (p-p)
* The sync pulse: a horizontal synchronization (hsync) pulse indicates the end of a
video line and the start of the next video line; sync nominal amplitude = 300 mV; sync is added to the video signal output via the SYNC input (active LOW)
* The blanking period: allows interface-free detection of both sync and video, blanking
is allocated either side of the sync pulse; the blank level is equal to the video black level; blanking is added to the video signal output via the BLANK input (active LOW). The values of SYNC and BLANK are latched on the rising edge of the clock signal. When no sync and no blank are applied, the DAC can be used continuously. This is the so-called generic mode. Because the signal delay in the DAC is 1.5 times the clock period, the sync and blank are also delayed by 1.5 times the clock period.
blanking period 0.7 V sync pulse
video information
0.3 V
mle291
Fig 3. Video signal sync pulse and blanking period
9. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDDA Vn Tstg Tamb Tj Parameter analog supply voltage voltage on digital input pins storage temperature ambient temperature junction temperature Conditions referred to VSSA1 referred to VSSA2 Min -0.5 -0.5 -55 0 -40 Max +6.5 +5.5 +150 70 +125 Unit V V C C C
TDA8777_4
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 -- 11 April 2006
6 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
10. Thermal characteristics
Table 5. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air for SOT313-2 Typ 88 Unit K/W
11. Characteristics
Table 6. Characteristics Typical values measured at VDDA = 3.3 V; RRSET = 560 ; Tamb = 25 C; unless otherwise specified. Symbol Supplies VDDA IDDA Ptot Ipd Inputs VIL VIH IIL IIH CIN VDDA IDDA VVREF RRSET RESDAC Io(DAC) INL DNL DACCT THD LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current input capacitance analog supply voltage analog supply current reference voltage input resistor for reference current DAC resolution DAC to DAC output current matching integral non-linearity differential non-linearity DAC to DAC crosstalk total harmonic distortion fCLK = 140 MHz fOUT = 1 MHz fOUT = 2.2 MHz fOUT = 4.7 MHz fOUT = 12 MHz fOUT = 22 MHz fOUT = 39 MHz 60 60 60 59 58 57 dB dB dB dB dB dB 2.0 3.0 -1.8 -0.9 5 3.3 2.7 1.23 560 54 0.8 80 120 3.6 10 4 +1.8 +0.9 V V A A pF V mA V bits % LSB LSB dB analog supply voltage analog supply current total power dissipation current in Power-down mode 3.0 3.3 90 297 20 3.6 V mA mW mA Parameter Conditions Min Typ Max Unit
Band gap reference
Digital-to-analog converter
TDA8777_4
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 -- 11 April 2006
7 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
Table 6. Characteristics ...continued Typical values measured at VDDA = 3.3 V; RRSET = 560 ; Tamb = 25 C; unless otherwise specified. Symbol THD Parameter total harmonic distortion Conditions fCLK = 240 MHz fOUT = 1 MHz fOUT = 2.2 MHz fOUT = 4.7 MHz fOUT = 12 MHz fOUT = 22 MHz fOUT = 39 MHz fCLK = 330 MHz fOUT = 1 MHz fOUT = 2.2 MHz fOUT = 4.7 MHz fOUT = 12 MHz fOUT = 22 MHz fOUT = 39 MHz SFDR spurious-free dynamic range to Nyquist limit fCLK = 140 MHz fOUT = 1 MHz fOUT = 2.2 MHz fOUT = 4.7 MHz fOUT = 12 MHz fOUT = 22 MHz fOUT = 39 MHz fCLK = 240 MHz fOUT = 1 MHz fOUT = 2.2 MHz fOUT = 4.7 MHz fOUT = 12 MHz fOUT = 22 MHz fOUT = 39 MHz fCLK = 330 MHz fOUT = 1 MHz fOUT = 2.2 MHz fOUT = 4.7 MHz fOUT = 12 MHz fOUT = 22 MHz fOUT = 39 MHz Outputs VO(compl) COUT output voltage compliance output capacitance 0 10 1.4 V pF 59 60 54 56 55 49 dB dB dB dB dB dB 61 61 63 58 58 54 dB dB dB dB dB dB 62 62 63 63 61 61 dB dB dB dB dB dB 60 60 60 60 53 47 dB dB dB dB dB dB 60 60 60 60 54 51 dB dB dB dB dB dB Min Typ Max Unit
TDA8777_4
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 -- 11 April 2006
8 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
Table 6. Characteristics ...continued Typical values measured at VDDA = 3.3 V; RRSET = 560 ; Tamb = 25 C; unless otherwise specified. Symbol Timing fCLK clock frequency TDA8777HL/14/C1 TDA8777HL/24/C1 TDA8777HL/33/C1 td(p) tsu(i) th(i) td(o) pipeline delay input set-up time input hold time output delay time in clock cycles see Figure 4 see Figure 4 see Figure 4 140 240 330 2.5 0 1.45 2.5 3.75 2.5 ns ns ns MHz MHz MHz Parameter Conditions Min Typ Max Unit
CLK
th(i)
Digital inputs (R9 to R0, G9 to G0, B9 to B0, SYNC, BLANK)
DATA
tsu(i)
td(o)
Analog outputs (OUTB, OUTB, OUTG, OUTG OUTR, OUTR)
001aaa892
Output delay (td(o)) is measured from the 50 % point of the rising edge of CLK to the 50 % point of full-scale transition.
Fig 4. Timing diagram digital inputs and analog outputs
TDA8777_4
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 -- 11 April 2006
9 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
12. Application information
001aad345 001aad347
0 THD (dB) -20
0 THD (dB) -20
-40
-40
-60
-60
-80 1 10 fOUT (MHz)
102
-80 1 10 fOUT (MHz)
102
Sampling frequency = 140 MHz.
Sampling frequency = 240 MHz.
Fig 5. THD as a function of fOUT, typical values
0 THD (dB) -20
001aad348
Fig 6. THD as a function of fOUT, typical values
0 SFDR (dB) -20
001aad427
-40
-40
-60
-60
-80 1 10 fOUT (MHz)
102
-80 1 10 fOUT (MHz)
102
Sampling frequency = 330 MHz.
Sampling frequency = 140 MHz.
Fig 7. THD as a function of fOUT, typical values
Fig 8. SFDR as a function of fOUT, typical values
TDA8777_4
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 -- 11 April 2006
10 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
0 SFDR (dB) -20
001aad428
0 SFDR (dB) -20
001aad429
-40
-40
-60
-60
-80 1 10 fOUT (MHz)
102
-80 1 10 fOUT (MHz)
102
Sampling frequency = 240 MHz
Sampling frequency = 330 MHz.
Fig 9. SFDR as a function of fOUT, typical values.
Fig 10. SFDR as a function of fOUT, typical values
560
PSAVE
RSET
R9
R8
R7
R6
R5
R4
R3
R2
R1
R0
VDDA VREF COMP OUTR OUTR OUTG OUTG VDDA3 VDDA2 OUTB OUTB VSSA2 VSSA1
0.1 F
48 G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 BLANK SYNC 1 2 3 4 5 6
47
46
45
44
43
42
41
40
39
38
37 36 35 34 33 32 31
TDA8777
7 8 9 10 11 12 13 VDDA1 14 B0 15 B1 16 B2 17 B3 18 B4 19 B5 20 B6 21 B7 22 B8 23 B9 24 CLK 30 29 28 27 26 25
001aaa890
VDDA
Fig 11. Application diagram
TDA8777_4
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 -- 11 April 2006
11 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
13. Package outline
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2
c
y X
36 37
25 24 ZE
A
e
E HE
A A2
A1
(A 3) Lp L detail X
wM pin 1 index 48 1 12 ZD bp D HD wM B vM B vM A 13 bp
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.20 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 7.1 6.9 E (1) 7.1 6.9 e 0.5 HD 9.15 8.85 HE 9.15 8.85 L 1 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 0.95 0.55 0.95 0.55 7 o 0
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT313-2 REFERENCES IEC 136E05 JEDEC MS-026 JEITA EUROPEAN PROJECTION
ISSUE DATE 00-01-19 03-02-25
Fig 12. Package outline SOT313-2 (LQFP48)
TDA8777_4 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 -- 11 April 2006
12 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 C to 260 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:
* below 225 C (SnPb process) or below 245 C (Pb-free process)
- for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages.
* below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
TDA8777_4 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 -- 11 April 2006
13 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
- smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C.
14.5 Package related soldering information
Table 7. Package[1] BGA, HTSSON..T[3], LBGA, LFBGA, SQFP, SSOP..T[3], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC[5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L[8], PMFP[9], WQCCN..L[8]
[1] [2]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable[4] Reflow[2] suitable suitable
suitable not not recommended[5][6] recommended[7]
suitable suitable suitable not suitable
not suitable
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
[3]
TDA8777_4
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 -- 11 April 2006
14 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[5] [6] [7] [8]
[9]
TDA8777_4
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 -- 11 April 2006
15 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
15. Revision history
Table 8. Revision history Release date 20060411 Data sheet status Product data sheet Change notice Supersedes TDA8777_3 Document ID TDA8777_4 Modifications: TDA8777_3 Modifications:
* * * * * * *
Status changed to Product data sheet. Characteristics table revised, see Table 6. Preliminary data sheet TDA8777_2 The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. Status changed to Preliminary data sheet. Characteristics table revised, SPDR and THD data added, see Table 6. Figure 4 corrected. Figure 5 through to Figure 10 added. Objective specification Objective specification TDA8777_1 -
20050815
TDA8777_2 (9397 750 13219) TDA8777_1 (9397 750 12054)
20040517 20040108
TDA8777_4
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 -- 11 April 2006
16 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
16. Legal information
16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com.
16.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
16.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
17. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
TDA8777_4
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 -- 11 April 2006
17 of 18
Philips Semiconductors
TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
18. Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 9 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Voltage reference . . . . . . . . . . . . . . . . . . . . . . . 5 Blanking and sync pulse insertion . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14 Package related soldering information . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 11 April 2006 Document identifier: TDA8777_4

▲Up To Search▲

Price & Availability of TDA8777HL14C1-T

	To Download TDA8777HL14C1-T Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .